Surface Science Western has worked with manufacturers of electronic devices from Canada, The United State and Asia. Much of our work has involved identifying residues and contaminants associated with the fabrication of microchips, photomasks and silicon wafers. We have also helped assemblers with quality control issues by examining defective solder joints, residue and contamination on circuit boards and addressed concerns with regard to lead content.
Companies that are active in research and development have also benefited from SSW’s expertise, including improving flat panel displays and evaluating prototype devices.
Electronics and Semiconductor Solutions
ToF-SIMS analysis of organic defects on photomask plates
Through-the-pellicle Raman analysis of haze defects
Analysis of process cleaning contaminants
Imaging of chromium patterning on 6” photomasks
Elemental analysis to determine the lead content of soldered joints
Examination of incomplete gold layer that provided a pathway for corrosion of copper contacts on PCBs
Ultra-shallow depth profiles of boron implants in silicon wafers